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Significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. This braid optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action. Minimal flux residue on the board speeds up the cleaning process or eliminates it entirely.
- Minimizes the risk of heat damage to the board
- Patented non-corrosive, halide-free, organic no-clean flux
- Desolders up to 40% faster and leaves boards cleaner than other no-clean braids
- Will not leave ionic contamination on the board
- Meets Bellcore TR-NWT-000078 and IPC SF-818 for Surface Insulation Resistance
- Minimizes the risk of damage assiciated with static electricity.
- ESD safe dissipative bobbins
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Departments:
FLIR |
Extech
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Rent Thermal Imaging Cameras
